LiFong(HK) Industrial Co.,Limited
LiFong (HK) industrial Co.,Limited We supply metal parts design, metal assembly parts solution and heat sink solution.
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Aluminum Heat Sinks Wide Water Cooling Head Plate CPU Semiconductor Cooling Sheet
Description:
Product name: water cooling head, water cooling plate.
Material thickness: primary color water cooling head GB 6063A, thickness of 11.5mm ±0.5Blue oxide water cooling head national standard 6063A, thickness 12MM±0.5Copper water cooling head contact surface pure copper, water nozzle brass, thickness of 9.5mm ±0.5 nozzle
Specification: aluminum water cooling head maximum diameter 9.5mm (suitable for the store 7-8mm inner diameter pipe)Maximum outer diameter of copper water cooling head is 8.5mm (suitable for the store's 7MM inner diameter water pipe)
Heat dissipation effect:Material comparison - copper thermal conductivity (401W/mk) is greater than 6063A aluminum thermal conductivity (201W/mk) copper heat dissipation effect is good.Channel Contrast - Finned channels are denser than M-shaped channels and carry away heat more easily.
Therefore, finned channels are superior to M-shaped channels
| Process | Friction Welding |
| Tolerance | As per customer's requirements |
| Finish | Polishing/Anodizing |
Packing and delivery
Packaging Details
We have the package advantage:
1) The internal blister tray or pearl wool;
2) external carton packaging.
Delivery Time
1) Sample in 3 workdays after payment.
2) Mass production after payment 20 days.
Welcome to send us the detailed drawings.